1 2-polybutadiene molding composition
    1.
    发明授权
    1 2-polybutadiene molding composition 失效
    1 2-聚丁二烯成型组合物

    公开(公告)号:US3635933A

    公开(公告)日:1972-01-18

    申请号:US3635933D

    申请日:1969-06-12

    Applicant: ALLIED CHEM

    CPC classification number: C08K5/14 C08L9/00

    Abstract: 1,2-BUTADIENE POLYMER HAVING AT LEAST 80% OF THE BUTADIENE CONTENT COMBINED THEREIN IN THE 1,2 FORM IS USED TOGETHER WITH A PEROXY CURING AGENT TO PRODUCED A MOLDING COMPOSITION. THE POLYBUTDIENE CAN BE IN A NORMALLY GRANULAR, CRYSTALLINE FORM OR IN NON-CRYSTALLINE FORM. THE COMPOSITION CURES AT GOOD RATE EVEN WHEN ANTIOXIDANT TO INHIBIT PREMATURE CURING IS INCLUDED IN THE COMPOSITION. A HEAT DISTORTION TEMPERATURE OF AT LEAST 250*C. CAN BE OBTAINED. CONVENTIONAL INGREDIENTS OF MOLDING COMPOUNDS SUCH AS FILLERS AND MOLD LUBRICANTS CAN BE INCORPORATED WITH THE COMPOSITION. THE COMPOSITION CAN BE WORKED WITHOUT CURING UP TO A TEMPERATURE OF ABOUT 150* C. AND CURED AT HIGHER TEMPERATURES.

    Crystalline 1 2-polybutadiene molding composition
    2.
    发明授权
    Crystalline 1 2-polybutadiene molding composition 失效
    晶体1 2-聚丁二烯成型组合物

    公开(公告)号:US3635934A

    公开(公告)日:1972-01-18

    申请号:US3635934D

    申请日:1969-06-12

    Applicant: ALLIED CHEM

    CPC classification number: C08K5/14 C08L9/00

    Abstract: CRYSTALLINE 1,2 BUTADIENE POLYMER IS USED TOGETHER WITH A FREE-RADICAL CURING AGENT TO PRODUCED A MOLDING COMPOSITION. THE POLYBUTADIENE IS IN THE NORMALLY GRANULAR, CRYSTALLINE. LARGELY SYNDIOTACTIC FORM. WHEN MOLDING COMPOSITIONS OF THIS POLYBUTADIENE ARE FORMULATED ON A ROLL MILL, THE COMPOSITIONS ARE GRANULATED. THOSE FORMULATED WITH PEROXY CURING AGENT WILL READILY CURE TO A HEAT DISTORTION TEMPERATURE OF AT LEAST 250*C. EVEN WHEN CONTAINING AN ANTIOXIDANT SERVING TO INHIBIT PREMATURE CURING. CONVENTIONAL INGREDIENTS OF MOLDING COMPOUNDS SUCH AS FILLERS AND MOLD LUBRICANTS CAN BE INCORPORATED WITH THE COMPOSITIONS. THE COMPOSITIONS INCLUDING A PEROXY CURING AGENT AND AN ANTIOXIDANT CAN BE WORKED WITHOUT CURING AT TEMPERATURES ABOVE THE FUSION TEMPERATURE, AND CURED AT HIGHER TEMPERATURES.

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