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公开(公告)号:US20240275253A1
公开(公告)日:2024-08-15
申请号:US18533986
申请日:2023-12-08
发明人: Yuki IKEZOE , Takahiro UMEZU , Takayuki SUIZU
IPC分类号: H02K33/18
摘要: A vibration generating device includes a stationary body including a bottom surface, a movable body disposed in an upper space of the bottom surface, and an elastic support disposed between the stationary and movable bodies and configured to support the movable body to be vibratable forward and backward to the stationary body. The elastic support includes a fixed portion fixed to the bottom surface, an upright portion extending upward from the fixed portion, an elastically deformable portion extending from the upright portion leftward and rightward, and a movable-body-attaching portion that extends from the elastically deformable portion and to which the movable body is attached. The elastic support includes a projection extending from the upright portion leftward and rightward at a position different from a position at which the elastically deformable portion extends from the upright portion leftward and rightward. A buffer is included between the projection and the stationary body.
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公开(公告)号:US20200258697A1
公开(公告)日:2020-08-13
申请号:US16778049
申请日:2020-01-31
发明人: Takahiro UMEZU , Takaki TANAKA , Keiko NATSUIZAKA
摘要: A switch includes a housing, a switching mechanism housed in the housing and configured to switch a state of connection between at least two terminals exposed out of the housing by using a common contact and two switching contacts, and an electronic component that is disposed in the housing and electrically connects the terminals to each other. The switching mechanism includes a first metal plate that is connected to a first contact, which is one of the common contact and the two switching contacts, and includes a first exposed part to which a first electrode of the electronic component is soldered by laser irradiation, and a second metal plate that is connected to a second contact, which is another one of the common contact and the two switching contacts, and includes a second exposed part to which a second electrode of the electronic component is soldered by laser irradiation.
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