公开(公告)号：US20140353303A1

公开(公告)日：2014-12-04

申请号：US14279664

申请日：2014-05-16

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Heishiro FUDO ,  Tomoko WAUKE ,  Eihin SETSU ,  Hirotoshi TERAO ,  Kazuma KOBASHI ,  Eiji OKADA ,  Susumu NAKAJIMA ,  Mikio Onodera

IPC: G03G15/20 ,  H05B3/28

CPC classification number: G03G15/2057 ,  G03G15/2053

Abstract: A heater for fixing devices includes a glass substrate, a heating element, electrode patterns connected to the heating element, a first protective layer, and a second protective layer. The glass substrate is made of an alkali-free glass. The first protective layer is formed by firing a mixture of a first glass powder and a first filler. The first glass powder contains no alkali metal oxide and has a lower softening point than the glass substrate. The first filler has a lower thermal expansion coefficient than the alkali-free glass for the glass substrate. The second protective layer is made of a material that does not contain the first filler contained in the first protective layer.

Abstract translation: 用于固定装置的加热器包括玻璃基板，加热元件，连接到加热元件的电极图案，第一保护层和第二保护层。 玻璃基板由无碱玻璃制成。 第一保护层通过烧制第一玻璃粉末和第一填料的混合物而形成。 第一玻璃粉末不含碱金属氧化物，并且具有比玻璃基材低的软化点。 第一填料的热膨胀系数低于玻璃基板的无碱玻璃。 第二保护层由不含第一保护层中的第一填料的材料制成。

公开(公告)号：US20170317265A1

公开(公告)日：2017-11-02

申请号：US15646160

申请日：2017-07-11

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Heishiro FUDO ,  Yasuji HAGIWARA ,  Daisuke TAKAI ,  Shoji SAKURAI ,  Masahiro ISHIDA ,  Yo TAHARA

IPC: H01L41/113 ,  H01L41/08 ,  H01L41/047 ,  H01L41/33 ,  H01L41/18

Abstract: A piezoelectric device includes a substrate that is flexible and thermally deformable, and a composite piezoelectric body disposed on the substrate. Output in accordance with deformation of the composite piezoelectric body is obtained. The composite piezoelectric body includes a piezoelectric layer containing an organic binder containing piezoelectric particles, a first electrode layer stacked on a first surface side of the piezoelectric layer, and a second electrode stacked on a second surface side of the piezoelectric layer. The substrate is insert molded and integrated with a molded resin body having a curved shape.