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公开(公告)号:US10026523B2
公开(公告)日:2018-07-17
申请号:US14685964
申请日:2015-04-14
发明人: Yui Abe , Yoshihiro Taguchi , Mitsuo Bito , Yoshiyuki Asabe , Yasuyuki Kitamura , Tomoyuki Yamai , Koji Oguma , Tomofumi Oba
IPC分类号: H01B5/14 , B82Y30/00 , H01L31/0224 , H01L31/18 , H01B1/02 , H01L51/00 , H05K1/09 , H05K3/38 , C23C14/34 , B82Y40/00 , H01L51/10 , H01L51/52 , H01L51/44
摘要: A conductor includes: a transparent conductive film which is formed on a transparent substrate and includes a silver nanowire; and a metal film of which at least a portion is formed to overlap the transparent conductive film, in which a portion in which the transparent conductive film and the metal film overlap each other includes a buffer film which has adhesion to each of the transparent conductive film and the metal film and does not impede conduction between the transparent conductive film and the metal film. Preferably, the buffer film is, for example, an ITO film, and at this time, an upper surface of the transparent conductive film is a reverse-sputtered surface.