公开(公告)号：US09785192B1

公开(公告)日：2017-10-10

申请号：US14069804

申请日：2013-11-01

Applicant: AMAZON TECHNOLOGIES, INC.

Inventor： Shan Cheng ,  Sasirekha Kodialam ,  Julie Marie Connors

IPC: G06F1/16 ,  B32B9/04 ,  B32B27/06 ,  C03C17/23

CPC classification number: G06F1/1643 ,  B32B9/04 ,  B32B27/06 ,  B32B2457/202 ,  C03C17/23

Abstract: Described in this disclosure is a surface configured to break down deposits thereon. The surface may include breakdown structures, oleophilic structures, and hydrophilic structures. The oleophilic structures and hydrophilic structures are configured to disperse a deposit, such as fingerprint residue, to the breakdown structures. This dispersion increases the surface area of the deposit with respect to the breakdown structures, increasing the contact area between the two. The breakdown structures modify the deposit physically, chemically, or both, such that fragments are distributed into the ambient environment. The surface may be applied to portable electronic devices.