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公开(公告)号：US20230137351A1
公开(公告)日：2023-05-04
申请号：US16349965
申请日：2017-11-14
Applicant: AMGEN INC.
Inventor： Wei YAN , Zhi LIU , Christopher MURAWSKY , Chadwick Terence KING , Yang LI , Zhonghua HU , Desiree LIM
IPC: C07K16/46
Abstract: The present invention relates to bispecific or biparatopic antigen binding proteins, polynucleotides encoding the same, and methods of making bispecific or biparatopic antigen binding proteins. Also described herein is a method to assemble IgG-like biparatopic or bispecific antibodies from VH only antigen binding proteins.
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