公开(公告)号：US20220396863A1

公开(公告)日：2022-12-15

申请号：US17623500

申请日：2020-06-26

Applicant: AMOGREENTECH CO., LTD.

Inventor： Sung Baek DAN

IPC: C23C14/00 ,  C23C14/16 ,  C23C14/20 ,  C23C14/34 ,  C23C14/02 ,  H01M4/04

Abstract: The present invention provides a method for manufacturing a thin film foil, wherein a metal thin film layer is formed on a base substrate through a vacuum deposition process to form an ultra-thin film foil having a thickness of 5 μm or less, preferably 2 μm or less. The provided method for manufacturing a thin film foil comprises the steps of: preparing a base substrate having release properties; preparing a metal raw material; vacuum-depositing the metal raw material on the base substrate to form a metal layer on the base substrate; and separating the base substrate from the metal layer to form a thin film foil, wherein one of a BeCu alloy, a Cu—Ag—Cr ternary alloy, an Ag alloy, a CuMo alloy, and a CuFeP alloy is prepared as the metal raw material.