Device for connecting leadless integrated circuit packages to a printed-circuit board
    2.
    发明授权
    Device for connecting leadless integrated circuit packages to a printed-circuit board 失效
    将无铅集成电路组件连接到印刷电路板的装置

    公开(公告)号:US3877064A

    公开(公告)日:1975-04-08

    申请号:US44504574

    申请日:1974-02-22

    Applicant: AMP INC

    CPC classification number: H05K7/1069

    Abstract: This invention relates to a device which electrically connects a leadless integrated circuit package to a printed circuit board. More particularly, the device includes a square frame having a plurality of "S" shaped contacts arranged along each side of the housing. The lower end of the contact electrically engages a circuit on the printed circuit board and the upper end electrically engages a circuit on the package. The frame further contains positioning and support clips which permits alignment of the package before engagement is made with the S shaped contacts.

    Abstract translation: 本发明涉及将无引线集成电路封装电连接到印刷电路板的装置。 更具体地,该装置包括具有沿壳体的每一侧布置的多个触点的正方形框架。 触点的下端电连接印刷电路板上的电路,并且上端与封装上的电路电接合。 框架还包括定位和支撑夹子,其允许在与接触件接合之前使包装件对准。

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