METHOD OF PRODUCING A RESIST STRUCTURE WITH UNDERCUT SIDEWALL
    1.
    发明申请
    METHOD OF PRODUCING A RESIST STRUCTURE WITH UNDERCUT SIDEWALL 有权
    用底板制造耐腐蚀结构的方法

    公开(公告)号:US20160179009A1

    公开(公告)日:2016-06-23

    申请号:US14910670

    申请日:2014-07-25

    Applicant: AMS AG

    CPC classification number: G03F7/2022 G03F1/50 G03F1/54 G03F7/168 G03F7/20 G03F7/32

    Abstract: The method comprises the steps of applying a layer of a negative photoresist on a bottom layer, providing the layer of the negative photoresist with a pattern arranged in a border zone of the resist structure to be produced, irradiating a surface area of the layer of the negative photoresist according to the resist structure to be produced, and removing the layer of the negative photoresist outside the irradiated surface area. The pattern is produced in such a manner that it comprises a dimension that is smaller than a minimal resolution of the irradiation. The pattern may especially be designed as a sub-resolution assist feature.

    Abstract translation: 该方法包括以下步骤:在底层上施加负性光致抗蚀剂层,为负光致抗蚀剂层提供布置在要制备的抗蚀剂结构的边界区域中的图案,照射所述层的 根据要制造的抗蚀剂结构的负性光致抗蚀剂,以及去除在照射的表面区域外的负性光致抗蚀剂层。 以这样的方式产生图案,使得其包括小于照射的最小分辨率的尺寸。 该图案可以特别地被设计为子分辨率辅助特征。

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