Environmental Sensor Test Methodology
    1.
    发明申请

    公开(公告)号:US20170219506A1

    公开(公告)日:2017-08-03

    申请号:US15010152

    申请日:2016-01-29

    CPC classification number: G01N27/12 G01N27/124 G01N33/007

    Abstract: We disclose herein a method for testing a batch of environmental sensors to determine the fitness for purpose of the batch of environmental sensors, the method comprising: performing a plurality of electrical test sequences to the sensor inputs of the batch of environmental sensors to measure electrical responses of the sensor outputs of the batch of environmental sensors; correlating the measured electrical responses from the batch of environmental sensors to predetermined environmental parametric ranges of at least one environmental sensor so as to define correlated electrical test limits; and determining the fitness for purpose of the batch of environmental sensors if the measured electrical responses are within the correlated electrical test limits.

    Environmental sensor test methodology

    公开(公告)号:US10429329B2

    公开(公告)日:2019-10-01

    申请号:US15010152

    申请日:2016-01-29

    Abstract: We disclose herein a method for testing a batch of environmental sensors to determine the fitness for purpose of the batch of environmental sensors, the method comprising: performing a plurality of electrical test sequences to the sensor inputs of the batch of environmental sensors to measure electrical responses of the sensor outputs of the batch of environmental sensors; correlating the measured electrical responses from the batch of environmental sensors to predetermined environmental parametric ranges of at least one environmental sensor so as to define correlated electrical test limits; and determining the fitness for purpose of the batch of environmental sensors if the measured electrical responses are within the correlated electrical test limits.

    Sensing Layer Formation
    3.
    发明申请

    公开(公告)号:US20190041346A1

    公开(公告)日:2019-02-07

    申请号:US16061428

    申请日:2016-12-13

    CPC classification number: G01N27/128 H01L21/67103 H01L21/67115

    Abstract: We disclose herein a method for heating a gas sensing material formulation on a microhotplate which comprises: a dielectric membrane formed on a semiconductor substrate comprising an etched portion; and the gas sensing material formulation being located on one side of the dielectric membrane. The method comprising: selectively heating the gas sensing material formulation using an infra-red (IR) heater located over the substrate, and controllably cooling the semiconductor substrate using a cooling baseplate provided under the substrate and using an insulating medium located between the substrate and the cooling base plate so that a gas sensing structure is formed on said one side of the dielectric membrane from the gas sensing material formulation.

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