公开(公告)号：US20140340302A1

公开(公告)日：2014-11-20

申请号：US14276238

申请日：2014-05-13

Applicant: ANALOG DEVICES, INC.

Inventor： Dipak Sengupta ,  Shrenik Deliwala ,  Ying Zhao ,  Bruce Fried ,  William Schoppee ,  Woodrow Beckford

IPC: G06F3/042 ,  G06F3/01

CPC classification number: G06F3/042 ,  G06F3/017 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48465 ,  H01L2224/73265 ,  Y10T29/49826 ,  H01L2924/00012

Abstract: An integrated gesture sensor module includes an optical sensor die, an application-specific integrated circuit (ASIC) die, and an optical emitter die disposed in a single package. The optical sensor die and ASIC die can be disposed in a first cavity of the package, and the optical emitter die can be disposed in a second cavity of the package. The second cavity can be conical or step-shaped so that the opening defining the cavity increases with distance from the upper surface of the optical emitter die. The upper surface of the optical emitter die may be higher than the upper surface of the optical sensor die. An optical barrier positioned between the first and second cavities can include a portion of a pre-molded, laminate, or ceramic package, molding compound, and/or metallized vias.

Abstract translation: 集成的手势传感器模块包括光学传感器芯片，专用集成电路（ASIC）裸片和设置在单个封装中的光发射器管芯。 光学传感器管芯和ASIC管芯可以设置在封装的第一腔中，并且光发射器管芯可以设置在封装的第二腔中。 第二空腔可以是圆锥形或阶梯形的，使得限定空腔的开口随着距离光发射器管芯的上表面的距离而增加。 光发射器管芯的上表面可以高于光学传感器管芯的上表面。 位于第一和第二腔之间的光学屏障可以包括预成型，层压或陶瓷封装，模塑料和/或金属化通孔的一部分。

公开(公告)号：US10884551B2

公开(公告)日：2021-01-05

申请号：US14276238

申请日：2014-05-13

Applicant: ANALOG DEVICES, INC.

Inventor： Dipak Sengupta ,  Shrenik Deliwala ,  Ying Zhao ,  Bruce Fried ,  William Schoppee ,  Woodrow Beckford

IPC: G06F3/042 ,  G06F3/01

Abstract: An integrated gesture sensor module includes an optical sensor die, an application-specific integrated circuit (ASIC) die, and an optical emitter die disposed in a single package. The optical sensor die and ASIC die can be disposed in a first cavity of the package, and the optical emitter die can be disposed in a second cavity of the package. The second cavity can be conical or step-shaped so that the opening defining the cavity increases with distance from the upper surface of the optical emitter die. The upper surface of the optical emitter die may be higher than the upper surface of the optical sensor die. An optical barrier positioned between the first and second cavities can include a portion of a pre-molded, laminate, or ceramic package, molding compound, and/or metallized vias.