公开(公告)号：US11424196B2

公开(公告)日：2022-08-23

申请号：US16282148

申请日：2019-02-21

Applicant: ANALOG DEVICES, INC.

Inventor： John C. Mahon ,  Peter J. Katzin ,  Song Lin

IPC: H01L23/66 ,  H01L23/48 ,  H03H7/38 ,  H01L23/00

Abstract: An integrated circuit (IC) die is disclosed. The IC die can include a signal via extending through the IC die. The IC die can include a transmission line extending laterally within the IC die in a direction non-parallel to the signal via, the transmission line configured to transfer an electrical signal to the signal via. The IC die can include a matching circuit disposed between the transmission line and the signal via. The matching circuit can include inductance and capacitance matching circuitry to compensate for parasitic inductance and capacitance introduced by transition from the IC die to an underlying carrier.