公开(公告)号：US10283582B2

公开(公告)日：2019-05-07

申请号：US13776545

申请日：2013-02-25

Applicant: ANALOG DEVICES GLOBAL

Inventor： Bernard P. Stenson ,  Michael Morrissey ,  Seamus A. Lynch

IPC: B81B7/00 ,  H01L49/02 ,  H01L27/01

Abstract: A microelectronic circuit having at least one component adjacent a carrier that is not a semiconductor or sapphire. The circuit includes a component bearing stack of one or more layers having one or more passive components, which are adjacent or bonded to the carrier. In certain embodiments, the circuit also includes an etch stop layer of a material having a slower etch rate than silicon and a bond layer bonding the carrier and the component bearing one or more layers.