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Patent Agency Ranking
公开(公告)号：US09941565B2
公开(公告)日：2018-04-10
申请号：US14922037
申请日：2015-10-23
Applicant: Analog Devices Global
Inventor： Conor John McLoughlin , Michael John Flynn , Laurence B. O'Sullivan , Shane Geary , Stephen O'Brien , Bernard P. Stenson , Baoxing Chen , Sarah Carroll , Michael Morrissey , Patrick M. McGuinness
CPC classification number: H01P1/36 , H01L2224/48137 , H01P5/187
Abstract: An isolator device and a corresponding method of forming the isolator device to include first and second electrodes, a layer of first dielectric material between the first and second electrodes, and at least one region of second dielectric material between the layer of first dielectric material and at least one of the first and second electrodes. The second dielectric material has a higher relative permittivity than the first dielectric material.
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公开(公告)号：US20170117602A1
公开(公告)日：2017-04-27
申请号：US14922037
申请日：2015-10-23
Applicant: Analog Devices Global
Inventor： Conor John McLoughlin , Michael John Flynn , Laurence B. O'Sullivan , Shane Geary , Stephen O'Brien , Bernard P. Stenson , Baoxing Chen , Sarah Carroll , Michael Morrissey , Patrick M. McGuinness
CPC classification number: H01P1/36 , H01L2224/48137 , H01P5/187
Abstract: An isolator device and a corresponding method of forming the isolator device to include first and second electrodes, a layer of first dielectric material between the first and second electrodes, and at least one region of second dielectric material between the layer of first dielectric material and at least one of the first and second electrodes. The second dielectric material has a higher relative permittivity than the first dielectric material.
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公开(公告)号：US20150325393A1
公开(公告)日：2015-11-12
申请号：US14667022
申请日：2015-03-24
Applicant: Analog Devices Global
Inventor： Bernard P. Stenson , Darren R. Lee , Padraig L. Fitzgerald , Michael Morrissey
CPC classification number: H01H59/0009 , B81C1/00261 , H01H1/0036
Abstract: A micromachined switch has a cavity with an atmosphere configured to reduce sparking between switch contacts during opening and closing operations.
Abstract translation: 微机械加工的开关具有空腔，其配置为在打开和关闭操作期间减少开关触点之间的火花。
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公开(公告)号：US10283582B2
公开(公告)日：2019-05-07
申请号：US13776545
申请日：2013-02-25
Applicant: ANALOG DEVICES GLOBAL
Inventor： Bernard P. Stenson , Michael Morrissey , Seamus A. Lynch
Abstract: A microelectronic circuit having at least one component adjacent a carrier that is not a semiconductor or sapphire. The circuit includes a component bearing stack of one or more layers having one or more passive components, which are adjacent or bonded to the carrier. In certain embodiments, the circuit also includes an etch stop layer of a material having a slower etch rate than silicon and a bond layer bonding the carrier and the component bearing one or more layers.
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公开(公告)号：US20180358166A1
公开(公告)日：2018-12-13
申请号：US16003621
申请日：2018-06-08
Applicant: Analog Devices Global Unlimited Company
Inventor： Jan Kubik , Bernard Patrick Stenson , Michael Morrissey
CPC classification number: H01F27/263 , H01F27/2804 , H01F2027/2809 , H01F2027/2819
Abstract: Techniques for fabricating low-loss magnetic vias within a magnetic core are provided. According to some embodiments, vias with small, well-defined sizes may be fabricated without reliance on precise alignment of layers. According to some embodiments, a magnetic core including a low-loss magnetic via can be wrapped around conductive coils of an inductor. The low-loss magnetic vias can improve performance of an inductive component by improving the quality factor relative to higher loss magnetic vias.
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