公开(公告)号：US20210134641A1

公开(公告)日：2021-05-06

申请号：US16486695

申请日：2018-02-17

Applicant: ANALOG DEVICES GLOBAL UNLIMITED COMPANY

Inventor： James G. Fiorenza ,  Susan L. Feindt ,  Michael D. Delaus ,  Matthew Duffy ,  Ryan lutzi ,  Kenneth Flanders ,  Rama Krishna Kotlanka

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/00 ,  H01L33/32 ,  H01L33/62

Abstract: A transfer printing method is described that can be used for a wide variety of materials, such as to allow for circuits formed of different materials to be integrated together on a single integrated circuit. A tether (18) is formed on dice regions (16) of a first wafer (30), followed by attachment of a second wafer (32) to the tethers. The dice regions (16) are processed so as to be separated, followed by transfer printing of the dice regions to a third wafer (34).