公开(公告)号：US20210082737A1

公开(公告)日：2021-03-18

申请号：US16989864

申请日：2020-08-10

Applicant: AP SYSTEMS INC.

Inventor： Chang Kyo KIM ,  Chang Min KWON

IPC: H01L21/687 ,  H01L21/67 ,  C23C16/458

Abstract: Provided are an edge ring and a heat treatment apparatus having the same. The edge ring includes a main body having a ring shape. The main body includes a substrate support part configured to support an edge of a bottom surface of a substrate, an outer band provided outside the substrate support part and having a top surface that is higher than a top surface of the substrate support part and is parallel to a top surface of the substrate supported by the substrate support part, an outer sidewall provided outside the outer band, and a groove part provided between the substrate support part and the outer band.