公开(公告)号：US20240282526A1

公开(公告)日：2024-08-22

申请号：US18476330

申请日：2023-09-28

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： CHUNG-JUI SU ,  CHENG-HAO LU

IPC: H01G4/224 ,  H01G4/32

CPC classification number: H01G4/224 ,  H01G4/32

Abstract: A wound capacitor package structure and a sealing element thereof are provided. The wound capacitor package structure includes a wound assembly, a conductive assembly, a package casing and a sealing element. The conductive assembly includes a first conductive pin and a second conductive pin. The package casing is configured to receive the wound assembly. The sealing element is disposed inside the package casing and cooperating with the package casing, and the sealing element is configured to prevent the wound assembly from contacting an external environment. The package casing has a surrounding concave position-limiting portion recessed inward to press the sealing element, and a surrounding convex end portion protruding from the surrounding concave position-limiting portion to abut against the sealing element. The sealing element includes an elastomeric seal structure pressed by the surrounding concave position-limiting portion, and an oleophobic structure for protecting the elastomeric seal structure.

公开(公告)号：US20240153708A1

公开(公告)日：2024-05-09

申请号：US18170536

申请日：2023-02-17

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： CHIEH LIN ,  CHUNG-JUI SU ,  CHENG-HAO LU

IPC: H01G4/224 ,  H01G4/242 ,  H01G4/32

CPC classification number: H01G4/224 ,  H01G4/242 ,  H01G4/32

Abstract: A wound capacitor package structure includes a wound assembly, a conductive assembly, a package assembly, a bottom seat plate and a pin protection assembly. The conductive assembly includes a first and a second conductive pin. The package assembly is configured for enclosing the wound assembly. The bottom seat plate is disposed on a bottom side of the package assembly. The pin protection assembly includes a first pin protection layer configured to partially cover the first conductive pin, and a second pin protection layer configured to partially cover the second conductive pin. The first conductive pin includes a first exposed portion exposed outside the package assembly, and the second conductive pin includes a second exposed portion exposed outside the package assembly. The first and the second pin protection layer are disposed on the first and the second exposed portion for protecting the first and the second conductive pin, respectively.