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公开(公告)号：US20210287857A1
公开(公告)日：2021-09-16
申请号：US16987753
申请日：2020-08-07
Applicant: APAQ TECHNOLOGY CO., LTD.
Inventor： CHIEH LIN
Abstract: A capacitor element and a method of manufacturing the same are provided. The method includes steps of: providing a metal foil having an oxide layer formed on an outer surface of the metal foil; forming a surrounding barrier layer onto the oxide layer so as to divide the outer surface of the oxide layer into a first part outer surface and a second part outer surface separated from each other; forming a base layer onto the oxide layer so as to partially encapsulate the oxide layer; cleaning the base layer by a cleaning solution and then drying the base layer; forming a conductive polymer layer onto the base layer; and forming a conductive paste layer onto the conductive polymer layer.
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公开(公告)号：US20180163040A1
公开(公告)日：2018-06-14
申请号：US15672933
申请日：2017-08-09
Applicant: APAQ TECHNOLOGY CO., LTD.
Inventor： CHIEH LIN , CHING-FENG LIN , MING-TSUNG CHEN
Abstract: The instant disclosure provides a polymer composite material, the method for manufacturing the polymer composite material, a capacitor package structure using the polymer composite material and the method for manufacturing the capacitor package structure. The polymer composite material is used for the cathode of a capacitor, wherein the polymer composite material includes poly(3,4-ethylenedioxythiophene), polystyrene sulfonate and a nanomaterial. Polystyrene sulfonate is connected between the nanomaterial and poly(3,4-ethylenedioxythiophene), and polystyrene sulfonate is bonded to the poly(3,4-ethylenedioxythiophene) through a polymerization process. The content of the nanomaterial ranges from 0.01-1.5 wt. % based on the weight of the polymer composite material.
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公开(公告)号：US20170352491A1
公开(公告)日：2017-12-07
申请号：US15602183
申请日：2017-05-23
Applicant: APAQ TECHNOLOGY CO., LTD.
Inventor： MING-TSUNG CHEN , CHIEH LIN
Abstract: The present disclosure provides a solid electrolytic capacitor package structure for increasing electrical performances and a method of manufacturing the same, and a capacitor unit thereof. The capacitor unit includes at least one first capacitor, the at least one first capacitor includes a conductive polymer composite material layer. The conductive polymer composite material layer includes a conductive polymer material and a first nanometer material mixed with the conductive polymer material, and the first nanometer material includes a plurality of first fully embedded nanometer structures completely enclosed by the conductive polymer material and a plurality of first partially exposed nanometer structures partially exposed from the conductive polymer material.
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公开(公告)号：US20250087428A1
公开(公告)日：2025-03-13
申请号：US18624283
申请日：2024-04-02
Applicant: APAQ TECHNOLOGY CO., LTD.
Inventor： CHIEH LIN , YI-YING WANG
Abstract: A capacitor assembly package structure, capacitor structure and method of manufacturing the same, and electronic device. The capacitor assembly package structure includes a capacitor assembly, an insulating package body and an electrode assembly. The capacitor assembly includes a plurality of capacitor structures that are stacked in sequence and electrically connected to each other. The insulating package body is configured to encapsulate a plurality of the capacitor structures. The electrode assembly includes a first electrode structure and a second electrode structure. Each of the capacitor structures includes a sintered silver layer, and the sintered silver layer includes more than 95% pure silver material. The average thickness of the sintered silver layer can be less than or equal to 1 μm, and the resistivity of the sintered silver layer can be less than the resistivity of a silver glue material formed by mixing epoxy resin and silver powder.
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公开(公告)号：US20230197354A1
公开(公告)日：2023-06-22
申请号：US18110558
申请日：2023-02-16
Applicant: APAQ TECHNOLOGY CO., LTD.
Inventor： CHIEH LIN
Abstract: A method of manufacturing a capacitor assembly package structure includes providing a capacitor unit and a conductive connection layer, in which the capacitor unit includes a plurality of capacitors, and each of the capacitors includes a positive portion and a negative portion electrically connected to the conductive connection layer; partially enclosing the capacitors by an insulative package body, in which the positive portion of each of the capacitors has a positive lateral surface exposed from a first lateral surface of the insulative package body; and then enclosing a first portion of the insulative package body and electrically connecting to the positive portion of each of the capacitors by a first electrode structure, and enclosing a second portion of the insulative package body and electrically connecting to the conductive connection layer by a second electrode structure.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20190189359A1
公开(公告)日：2019-06-20
申请号：US16218753
申请日：2018-12-13
Applicant: APAQ TECHNOLOGY CO., LTD.
Inventor： CHIEH LIN , SHANG-CHE LAN , MING-TSUNG CHEN
IPC: H01G9/028 , H01G9/15 , H01B1/22 , H01B1/12 , H01G11/48 , H01B5/14 , H05K1/09 , H01G9/012 , H01G11/60
CPC classification number: H01G9/028 , H01B1/127 , H01B1/22 , H01B5/14 , H01G9/012 , H01G9/15 , H01G11/48 , H01G11/60 , H05K1/092
Abstract: A printable conductive composite slurry, a capacitor using the same and a method for manufacturing the capacitor are provided. The method includes forming a conductive polymer layer on a cathode portion of a capacitor element and printing a conductive composite slurry onto the conductive polymer layer to at least cover a portion of the conductive polymer layer that is disposed on an outer edge of the cathode portion. The printable conductive composite slurry includes a conductive material and a solvent, and has a solid content of at least 4%, a pH value ranging from 2 to 8 and a viscosity higher than 500 poise.
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公开(公告)号：US20180233299A1
公开(公告)日：2018-08-16
申请号：US15717537
申请日：2017-09-27
Applicant: APAQ TECHNOLOGY CO., LTD.
Inventor： MING-GOO CHIEN , CHIEH LIN
CPC classification number: H01G11/32 , H01G9/012 , H01G9/048 , H01G9/055 , H01G9/06 , H01G9/10 , H01G9/151 , H01G11/26 , H01G11/52 , H01G11/74
Abstract: The present disclosure provides a capacitor package structure and an anti-oxidation electrode foil thereof. The anti-oxidation electrode foil includes a base material structure, a first low activity metal structure, and a first carbonaceous material structure. The base material structure has a top surface and a bottom surface. The first low activity metal structure is disposed on the top surface of the base material structure. The first carbonaceous material structure is disposed on the first low activity metal structure. When oxygen passes through the first carbonaceous material structure, the oxygen is obstructed by the first low activity metal structure for preventing the oxygen from contacting the base material structure.
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公开(公告)号：US20240431032A1
公开(公告)日：2024-12-26
申请号：US18417051
申请日：2024-01-19
Applicant: APAQ TECHNOLOGY CO., LTD.
Inventor： CHING-FENG LIN , CHIEH LIN , MING-TSUNG LIANG , CHUNG-JUI SU
Abstract: A laterally placed capacitor package assembly and an assembly method thereof are provided. The laterally placed capacitor package assembly includes a wound capacitor package structure and a capacitor supporting structure. The wound capacitor package structure includes a wound assembly, a conductive assembly and a package assembly. The conductive assembly includes a first conductive pin and a second conductive pin. The capacitor supporting structure includes a supporting portion configured to support the wound capacitor package structure and a plurality of positioning portions extending outward from the supporting portion. When the laterally placed capacitor package assembly is configured to be laterally disposed on a circuit substrate, a first exposed portion of the first conductive pin and a second exposed portion of the second conductive pin can be laterally and electrically connected to the circuit substrate without bending.
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公开(公告)号：US20210327651A1
公开(公告)日：2021-10-21
申请号：US17024875
申请日：2020-09-18
Applicant: APAQ TECHNOLOGY CO., LTD.
Inventor： CHIEH LIN
Abstract: A capacitor assembly package structure and a method of manufacturing the same are provided. The capacitor assembly package structure includes a capacitor unit, an insulative package body, a conductive connection layer and an electrode unit. The capacitor unit includes a plurality of capacitors, and each capacitor includes a positive portion and a negative portion. The insulative package body partially encloses the capacitors, and the positive portion has a positive lateral surface exposed from a first lateral surface of the insulative package body. The conductive connection layer is electrically connected to the negative portion. The electrode unit includes a first electrode structure and a second electrode structure. The first electrode structure encloses a first portion of the insulative package body and electrically connects to the positive portion, and the second electrode structure encloses a second portion of the insulative package body and electrically connects to the conductive connection layer.
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公开(公告)号：US20210287856A1
公开(公告)日：2021-09-16
申请号：US17024847
申请日：2020-09-18
Applicant: APAQ TECHNOLOGY CO., LTD.
Inventor： CHIEH LIN
Abstract: A capacitor element and a method for manufacturing the same are provided. The method for manufacturing the capacitor element includes steps of: providing a metal foil having an oxide layer formed on an outer surface of the metal foil; forming a surrounding barrier layer surroundingly on the oxide layer with the surrounding barrier layer surroundingly formed on an outer surface of the oxide layer; forming a priming layer onto the oxide layer; immersing the priming layer into a chemical synthesis solution for undergoing a chemical synthesis reaction; drying the priming layer so as to form a repaired layer on the priming layer; forming a conductive polymer layer on the repaired layer; and forming a conductive paste layer on the conductive polymer layer with the conductive paste layer including a silver paste layer.
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