公开(公告)号：US20240428991A1

公开(公告)日：2024-12-26

申请号：US18417037

申请日：2024-01-19

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： CHIEH LIN ,  CHENG-JHE SIE ,  YI-YING WANG

IPC: H01G4/012 ,  H01G4/008 ,  H01G4/30

Abstract: A stacked capacitor assembly and a method of manufacturing the same, and a stacked capacitor package structure are provided. The stacked capacitor assembly includes a plurality of conductive substrates, an inner conductive structure and an outermost covering structure. Each of the conductive substrates has a first portion and a second portion opposite to the first portion. The inner conductive structure is configured to cover the first portion of each of the conductive substrates and be disposed between any two adjacent ones of the conductive substrates. The outermost covering structure is configured to cover the inner conductive structure. The inner conductive structure is provided without carbon-containing materials or silver-containing materials, and a space is formed between any two adjacent ones of the conductive substrates without carbon-containing materials or silver-containing materials.