公开(公告)号：US20170110256A1

公开(公告)日：2017-04-20

申请号：US15147120

申请日：2016-05-05

Applicant: APAQ TECHNOLOGY CO., LTD.

Inventor： CHING-FENG LIN ,  LIANG-MIN KAO ,  CHUN-CHIA HUANG

IPC: H01G9/10 ,  H01G9/26 ,  H01G13/00 ,  H01G9/15

CPC classification number: H01G9/10 ,  H01G9/012 ,  H01G9/14 ,  H01G9/15 ,  H01G9/26

Abstract: The instant disclosure provides a solid electrolytic capacitor package structure and method of manufacturing the same. The solid electrolytic capacitor package structure includes a capacitor assembly, at least one electrode pin and a package body enclosing the capacitor assembly and the electrode pin. The electrode pin includes an embedded portion enclosed by the package body and an exposed portion positioned outside the package body. The method of manufacturing the solid electrolytic capacitor package structure includes a protection step including forming a protecting film on the exposed portion; a coating step including depositing a nanomaterial on the solid electrolytic capacitor package structure to form a nanofilm, wherein the nanomaterial penetrates into defects of the solid electrolytic capacitor package structure; and a deprotection step including removing the protecting film. The instant disclosure provides improved air-tight and water-tight properties of the solid electrolytic capacitor package structure, thereby increasing the lifetime thereof.