公开(公告)号：US20140240195A1

公开(公告)日：2014-08-28

申请号：US13780787

申请日：2013-02-28

Applicant: APPLE INC.

Inventor： Boon W. Shiu ,  Jerzy Guteman ,  Mattia Pascolini

IPC: H01Q21/00 ,  B23K1/00

CPC classification number: H01Q1/24 ,  H01Q9/42 ,  H01Q21/28

Abstract: A wireless electronic device may be provided with antenna structures. The antenna structures may be formed from an antenna ground and an array of antenna resonating elements. The antenna resonating elements may be electrically connected to the antenna ground using solder. The antenna resonating elements may be formed from metal traces on a dielectric support structure that surrounds the antenna ground. The antenna ground may be formed form stamped sheet metal and may have slanted steps adjacent to the antenna resonating elements. To form a solder joint between the metal antenna resonating element traces and the sheet metal of the antenna ground, laser light may be applied to the sheet metal of the antenna ground in the vicinity of the solder paste. Separate metal members may also be provided in the vicinity of the solder paste and may be heated using the laser to join metal traces on plastic carriers.

Abstract translation: 无线电子设备可以设置有天线结构。 天线结构可以由天线接地和天线谐振元件阵列形成。 天线谐振元件可以使用焊料电连接到天线接地。 天线谐振元件可以由围绕天线接地的电介质支撑结构上的金属迹线形成。 天线接地可以形成为冲压的金属片，并且可以具有与天线谐振元件相邻的倾斜台阶。 为了在金属天线谐振元件迹线和天线地线的金属片之间形成焊接点，可以将激光施加到焊料附近的天线地板的金属片上。 也可以在焊膏附近设置单独的金属构件，并且可以使用激光加热以将塑料载体上的金属迹线结合。