公开(公告)号：US20210007248A1

公开(公告)日：2021-01-07

申请号：US16502059

申请日：2019-07-03

Applicant: APPLE INC.

Inventor： Lidu Huang ,  Alaa Al-okaily ,  Anuranjini Pragada ,  Colleen F. Mischke ,  Derek J. Iredale ,  Michael R. Monson ,  Nagarajan Kalyanasundaram ,  Peng Chen ,  Pierre P. Souloumiac

IPC: H05K7/20 ,  G03B17/55 ,  H04M1/02

Abstract: An electronic module includes an operational subunit, having upper, lower and lateral surfaces, and including one or more electronic components, which are adjacent to the lower surface of the operational subunit and generate heat when the module is in operation. A heat sink is disposed in proximity to the lower surface of the operational subunit. A heat spreader, including a continuous sheet of a heat-conducting material, is folded to wrap around the operational subunit so that a lower side of the sheet is interposed between the lower surface of the operational subunit and the heat sink and a lateral side of the sheet extends around at least one of the lateral surfaces of the operational subunit.