Predictive control systems and methods
    1.
    发明授权

    公开(公告)号:US10671131B2

    公开(公告)日:2020-06-02

    申请号:US14871526

    申请日:2015-09-30

    Applicant: Apple Inc.

    Abstract: Systems and methods are disclosed for determining a current machine state of a processing device, predicting a future processing task to be performed by the processing device at a future time, and predicting a list of intervening processing tasks to be performed by a first time (e.g. a current time) and the start of the future processing task. The future processing task has an associated initial state. A feed-forward thermal prediction model determines a predicted future machine state at the time for starting the future processing task. Heat mitigation processes can be applied in advance of the starting of the future processing task, to meet the future initial machine state for starting the future processing task.

    Determining ambient temperature using transient device characteristics

    公开(公告)号:US10309840B2

    公开(公告)日:2019-06-04

    申请号:US14950454

    申请日:2015-11-24

    Applicant: Apple Inc.

    Abstract: Embodiments described herein are directed to determining an ambient temperature of an environment in which a device is operating. In some embodiments, the ambient temperature of the environment is determined by determining an initial temperature of the device and also determining when the temperature of the device reaches a first temperature threshold. When the temperature of the device reaches the first temperature threshold, the device is allowed to cool for a predetermined amount of time. Upon expiration of the amount of time, a change in temperature of the device over the amount of time is detected. The detected change in temperature is then used to determine an ambient temperature of the environment in which the device is operating.

    MAGNETIC SHIELDING IN INDUCTIVE POWER TRANSFER
    5.
    发明申请
    MAGNETIC SHIELDING IN INDUCTIVE POWER TRANSFER 有权
    感应电力传输中的磁屏蔽

    公开(公告)号:US20150270058A1

    公开(公告)日:2015-09-24

    申请号:US14666793

    申请日:2015-03-24

    Applicant: Apple Inc.

    CPC classification number: H01F38/14 H01F27/365 H01F2027/348

    Abstract: A first electronic device connects with an second electronic device. The first electronic device may include a first connection surface and an inductive power transfer receiving coil and a first magnetic element positioned adjacent to the first connection surface. The second electronic device may similarly include a second connection surface and an inductive power transfer transmitting coil and second magnetic element positioned adjacent to the second connection surface. In the aligned position, alignment between the electronic devices may be maintained by magnetic elements and the inductive power coils may be configured to exchange power. The magnetic elements and/or the inductive power coils may include a shield that is configured to minimize or reduce eddy currents caused in the magnetic elements by the inductive power coils.

    Abstract translation: 第一电子设备与第二电子设备连接。 第一电子设备可以包括第一连接表面和感应功率传递接收线圈以及邻近第一连接表面定位的第一磁性元件。 第二电子设备可以类似地包括第二连接表面和感应功率传递传递线圈以及邻近第二连接表面定位的第二磁性元件。 在对准位置,可以通过磁性元件来维持电子设备之间的对准,并且感应功率线圈可被配置为交换电力。 磁性元件和/或感应功率线圈可以包括被配置为最小化或减少由感应功率线圈在磁性元件中引起的涡流的屏蔽。

    Cladded metal structures for dissipation of heat in a portable electronic device

    公开(公告)号:US10856443B2

    公开(公告)日:2020-12-01

    申请号:US16407011

    申请日:2019-05-08

    Applicant: Apple Inc.

    Abstract: This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.

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