Abstract:
Systems and methods are disclosed for determining a current machine state of a processing device, predicting a future processing task to be performed by the processing device at a future time, and predicting a list of intervening processing tasks to be performed by a first time (e.g. a current time) and the start of the future processing task. The future processing task has an associated initial state. A feed-forward thermal prediction model determines a predicted future machine state at the time for starting the future processing task. Heat mitigation processes can be applied in advance of the starting of the future processing task, to meet the future initial machine state for starting the future processing task.
Abstract:
One or more operations in an electronic device can be adjusted based on environment data, such as temperature data and/or humidity data. The electronic device may be, for example, a receiver device or a transmitter device in an inductive energy transfer system. Example operations that may be adjusted based on environmental data include, but are not limited to, the brightness of a display or a haptic output produced by a haptic mechanism.
Abstract:
Embodiments described herein are directed to determining an ambient temperature of an environment in which a device is operating. In some embodiments, the ambient temperature of the environment is determined by determining an initial temperature of the device and also determining when the temperature of the device reaches a first temperature threshold. When the temperature of the device reaches the first temperature threshold, the device is allowed to cool for a predetermined amount of time. Upon expiration of the amount of time, a change in temperature of the device over the amount of time is detected. The detected change in temperature is then used to determine an ambient temperature of the environment in which the device is operating.
Abstract:
Various techniques for temperature management during inductive energy transfer are disclosed. A transmitter device and/or a receiver device can be turned off during energy transfer based on the temperature of the transmitter device and/or of the receiver device.
Abstract:
A first electronic device connects with an second electronic device. The first electronic device may include a first connection surface and an inductive power transfer receiving coil and a first magnetic element positioned adjacent to the first connection surface. The second electronic device may similarly include a second connection surface and an inductive power transfer transmitting coil and second magnetic element positioned adjacent to the second connection surface. In the aligned position, alignment between the electronic devices may be maintained by magnetic elements and the inductive power coils may be configured to exchange power. The magnetic elements and/or the inductive power coils may include a shield that is configured to minimize or reduce eddy currents caused in the magnetic elements by the inductive power coils.
Abstract:
An electronic module includes an operational subunit, having upper, lower and lateral surfaces, and including one or more electronic components, which are adjacent to the lower surface of the operational subunit and generate heat when the module is in operation. A heat sink is disposed in proximity to the lower surface of the operational subunit. A heat spreader, including a continuous sheet of a heat-conducting material, is folded to wrap around the operational subunit so that a lower side of the sheet is interposed between the lower surface of the operational subunit and the heat sink and a lateral side of the sheet extends around at least one of the lateral surfaces of the operational subunit.
Abstract:
This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.
Abstract:
Various techniques for temperature management during inductive energy transfer are disclosed. A transmitter device and/or a receiver device can be turned off during energy transfer based on the temperature of the transmitter device and/or of the receiver device.
Abstract:
A first electronic device connects with an second electronic device. The first electronic device may include a first connection surface and an inductive power transfer receiving coil and a first magnetic element positioned adjacent to the first connection surface. The second electronic device may similarly include a second connection surface and an inductive power transfer transmitting coil and second magnetic element positioned adjacent to the second connection surface. In the aligned position, alignment between the electronic devices may be maintained by magnetic elements and the inductive power coils may be configured to exchange power. The magnetic elements and/or the inductive power coils may include a shield that is configured to minimize or reduce eddy currents caused in the magnetic elements by the inductive power coils.
Abstract:
In various embodiments, an electronic band for a wearable device having: a first band segment including a first affixing structure configured to couple the first band segment to the wearable device when inserted into a first channel of the wearable device, a processing unit, and a first electrical connector having a plurality of contact pins at least some of which are electrically connected to the processing unit; where the first electrical connector electrically connects the processing unit of the first band segment to a second electronic component positioned within the wearable device when the first affixing structure is inserted into the first channel.