公开(公告)号：US12289559B2

公开(公告)日：2025-04-29

申请号：US17590036

申请日：2022-02-01

Applicant: APPLE INC.

Inventor： Sai Harsha Jandhyala ,  Raffi A. Bedikian

IPC: G06T7/246 ,  G06T7/73 ,  G06T7/90 ,  G06V10/143 ,  G06V10/20 ,  G06V10/70 ,  G06V10/80 ,  G06V40/20 ,  H04N5/33

Abstract: Various implementations disclosed herein include devices, systems, and methods that identify a gesture based on event camera data and frame-based camera data (e.g., for a CGR environment). In some implementations at an electronic device having a processor, event camera data is obtained corresponding to light (e.g., IR light) reflected from a physical environment and received at an event camera. In some implementations, frame-based camera data is obtained corresponding to light (e.g., visible light) reflected from the physical environment and received at a frame-based camera. In some implementations, a subset of the event camera data is identified based on the frame-based camera data, and a gesture (e.g., of a person in the physical environment) is identified based on the subset of event camera data. In some implementations, a path (e.g., of a hand) by tracking a grouping of blocks of event camera events in the subset of event camera data.

公开(公告)号：US12063742B1

公开(公告)日：2024-08-13

申请号：US17715852

申请日：2022-04-07

Applicant: Apple Inc.

Inventor： Sai Harsha Jandhyala ,  Himesh Patel

IPC: H05K1/18 ,  G03B5/04 ,  G03B13/36 ,  H02K41/035 ,  H04N23/54 ,  H04N23/55 ,  H04N23/67 ,  H04N23/68 ,  H05K3/30

CPC classification number: H05K1/181 ,  G03B5/04 ,  G03B13/36 ,  H02K41/0354 ,  H04N23/54 ,  H04N23/55 ,  H04N23/67 ,  H04N23/687 ,  H05K3/303 ,  G03B2205/0069 ,  H05K2201/1009 ,  H05K2201/10151

Abstract: A camera may include a printed circuit board (PCB) that may include at least one coil and at least one position sensor. The coil may be embedded at least partially inside the PCB at a first side of the PCB, whilst the position sensor may be attached to the PCB at a second side opposite the first side. The PCB may include an aperture through the PCB at a location corresponding to the position sensor to enhance sensing of the position sensor. The PCB may further include at least one recess inside which the position sensor may be attached to the PCB.