公开(公告)号：US20140197151A1

公开(公告)日：2014-07-17

申请号：US13742639

申请日：2013-01-16

Applicant: APPLIED MATERIALS, INC.

Inventor： LEON VOLFOVSKI ,  MAYUR G. KULKARNI ,  ALEX MINKOVICH ,  MICHAEL R. RICE

IPC: H05B1/02 ,  H05B3/26

CPC classification number: H05B3/26 ,  H01L21/67103 ,  H05B1/0233

Abstract: Embodiments of substrate supports with a heater are provided herein. In some embodiments, a substrate support may include a first member to distribute heat to a substrate when present above a first planar surface of the first member, a second member disposed beneath the first member, the second member including a plurality of resistive heating elements, wherein the plurality of resistive heating elements provide local temperature compensation to the first member to heat the substrate when present, a third member disposed beneath the second member, the third member including one or more base heating zones to provide a base temperature profile to the first member, and a fourth member disposed beneath the third member, the fourth member including a first set of electrical conductors coupled to each of the resistive heating elements.

Abstract translation: 本文提供了具有加热器的基板支撑件的实施例。 在一些实施例中，衬底支撑件可以包括第一构件，用于当存在于第一构件的第一平面表面上方时将热量分配到衬底;第二构件，设置在第一构件下方，第二构件包括多个电阻加热元件， 其中所述多个电阻加热元件在存在时向所述第一构件提供局部温度补偿以加热所述基板，设置在所述第二构件下方的第三构件，所述第三构件包括一个或多个基座加热区以向所述第一构件提供基座温度曲线 以及设置在所述第三构件下方的第四构件，所述第四构件包括耦合到每个所述电阻加热元件的第一组电导体。