公开(公告)号：US20140197151A1

公开(公告)日：2014-07-17

申请号：US13742639

申请日：2013-01-16

Applicant: APPLIED MATERIALS, INC.

Inventor： LEON VOLFOVSKI ,  MAYUR G. KULKARNI ,  ALEX MINKOVICH ,  MICHAEL R. RICE

IPC: H05B1/02 ,  H05B3/26

CPC classification number: H05B3/26 ,  H01L21/67103 ,  H05B1/0233

Abstract: Embodiments of substrate supports with a heater are provided herein. In some embodiments, a substrate support may include a first member to distribute heat to a substrate when present above a first planar surface of the first member, a second member disposed beneath the first member, the second member including a plurality of resistive heating elements, wherein the plurality of resistive heating elements provide local temperature compensation to the first member to heat the substrate when present, a third member disposed beneath the second member, the third member including one or more base heating zones to provide a base temperature profile to the first member, and a fourth member disposed beneath the third member, the fourth member including a first set of electrical conductors coupled to each of the resistive heating elements.

Abstract translation: 本文提供了具有加热器的基板支撑件的实施例。 在一些实施例中，衬底支撑件可以包括第一构件，用于当存在于第一构件的第一平面表面上方时将热量分配到衬底;第二构件，设置在第一构件下方，第二构件包括多个电阻加热元件， 其中所述多个电阻加热元件在存在时向所述第一构件提供局部温度补偿以加热所述基板，设置在所述第二构件下方的第三构件，所述第三构件包括一个或多个基座加热区以向所述第一构件提供基座温度曲线 以及设置在所述第三构件下方的第四构件，所述第四构件包括耦合到每个所述电阻加热元件的第一组电导体。

公开(公告)号：US20130256966A1

公开(公告)日：2013-10-03

申请号：US13845492

申请日：2013-03-18

Applicant: APPLIED MATERIALS, INC.

Inventor： LEON VOLFOVSKI ,  MAYUR G. KULKARNI

IPC: H05B3/26

CPC classification number: H05B3/26 ,  H01L21/67103 ,  H01L21/68792

Abstract: Apparatus for providing electrical currents and substrate supports utilizing the same are provided. In some embodiments, a feedthrough structure may include a body having a wall defining one or more openings disposed through the body from a first end to a second end; one or more first conductors and one or more second conductors each disposed in the wall from the first end to the second end; and a plurality of conductive mesh disposed in the wall, at least one conductive mesh surrounding a first region of the wall including the one or more first conductors and at least one conductive mesh surrounding a second region of the wall including the one or more second conductors, wherein the plurality of conductive mesh substantially electrically insulates the first and second regions from respective first and second external electromagnetic fields respectively disposed outside the first and second regions.

Abstract translation: 提供了用于提供电流的装置和利用其的基板支撑件。 在一些实施例中，馈通结构可以包括主体，其具有限定从第一端到第二端设置穿过主体的一个或多个开口的壁; 一个或多个第一导体和一个或多个第二导体，每个第二导体各自设置在从第一端到第二端的壁中; 以及设置在所述壁中的多个导电网，围绕所述壁的第一区域的至少一个导电网，所述第一区域包括所述一个或多个第一导体和围绕所述壁的第二区域的至少一个导电网，所述导电网包括所述一个或多个第二导体 ，其中所述多个导电网将所述第一和第二区域与分别设置在所述第一和第二区域之外的相应的第一和第二外部电磁场基本上电绝缘。

公开(公告)号：US20170018441A1

公开(公告)日：2017-01-19

申请号：US15264082

申请日：2016-09-13

Applicant: APPLIED MATERIALS, INC.

Inventor： JAMES MATTHEW HOLDEN ,  SONG-MOON SUH ,  TODD EGAN ,  KALYANJIT GHOSH ,  LEON VOLFOVSKI ,  MICHAEL R. RICE ,  RICHARD GILJUM

IPC: H01L21/67 ,  B01D39/12 ,  B08B5/00 ,  H01L21/02 ,  B08B7/00

CPC classification number: H01L21/67028 ,  B01D39/12 ,  B08B5/00 ,  B08B7/00 ,  H01L21/02076 ,  H01L21/02087 ,  H01L21/0209 ,  H01L21/67051

Abstract: A substrate cleaning apparatus may include a substrate support having a support surface to support a substrate to be cleaned, wherein the substrate support is rotatable about a central axis normal to the support surface; a first nozzle to provide a first cleaning gas to a region of the inner volume corresponding to the position of an edge of the substrate when the substrate is supported by the support surface of the substrate support; a first annular body disposed opposite and spaced apart from the support surface of the substrate support by a gap, the first annular body having a central opening defined by an inner wall shaped to provide a reducing size of the gap between the first annular body and the support surface in a radially outward direction; and a first gas inlet to provide a first gas to the central opening of the first annular body.

Abstract translation: 基板清洁装置可以包括具有支撑表面以支撑要清洁的基板的基板支撑件，其中基板支撑件可绕垂直于支撑表面的中心轴线旋转; 第一喷嘴，用于当所述基板由所述基板支撑件的支撑表面支撑时，将第一清洁气体提供到所述内部体积的与所述基板的边缘的位置相对应的区域; 第一环形体，其通过间隙与衬底支撑件的支撑表面相对设置并间隔开，第一环形体具有由内壁限定的中心开口，内壁被成形为提供第一环形体和第二环形体之间的间隙的减小尺寸 支撑表面沿径向向外的方向; 以及第一气体入口，用于向第一环形体的中心开口提供第一气体。

公开(公告)号：US20150076135A1

公开(公告)日：2015-03-19

申请号：US14481283

申请日：2014-09-09

Applicant: APPLIED MATERIALS, INC.

Inventor： NIR MERRY ,  LEON VOLFOVSKI

IPC: H01L23/34 ,  H05B3/28 ,  H01L21/683

CPC classification number: H01L23/34 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/683 ,  H01L21/68792 ,  H01L2924/0002 ,  H05B3/283 ,  Y10T29/49083 ,  H01L2924/00

Abstract: Methods and apparatus of substrate supports having temperature profile control are provided herein. In some embodiments, a substrate support includes: a plate having a substrate receiving surface and an opposite bottom surface; and a shaft having a first end comprising a shaft heater and a second end, wherein the first end is coupled to the bottom surface. Methods of making a substrate support having temperature profile control are also provided.

Abstract translation: 本文提供了具有温度分布控制的基板支撑件的方法和装置。 在一些实施例中，衬底支撑件包括：板，其具有衬底接收表面和相对的底表面; 以及轴，其具有包括轴加热器和第二端的第一端，其中所述第一端联接到所述底表面。 还提供了制造具有温度分布控制的基板支撑件的方法。