公开(公告)号：US11527424B2

公开(公告)日：2022-12-13

申请号：US16825450

申请日：2020-03-20

Applicant: APPLIED MATERIALS, INC.

Inventor： Alex Berger ,  Jeffrey Hudgens ,  Eric Englhardt

IPC: H01L21/677 ,  B65G54/02 ,  B25J11/00

Abstract: Disclosed herein are systems and methods relating to a transfer chamber for an electronic device processing system. The transfer chamber can include a first magnetic levitation track having a face-up orientation and a second magnetic levitation track spaced from the first magnetic levitation track and having a face-down orientation. The system can include substrate carriers that move along the first and second magnetic levitation tracks where each substrate carrier includes a magnet on a bottom portion to interact with a first magnetic field and a second magnet on a top portion to interact with a second magnetic field. The system also can include at least one lift pin assembly to move the substrate carriers in a vertical direction between the first and second magnetic levitation tracks.

公开(公告)号：US20240071796A1

公开(公告)日：2024-02-29

申请号：US18243433

申请日：2023-09-07

Applicant: Applied Materials, Inc.

Inventor： Alex Berger ,  Jeffrey Hudgens ,  Eric Englhardt

IPC: H01L21/677 ,  B25J11/00 ,  B65G54/02

CPC classification number: H01L21/67709 ,  B25J11/0095 ,  B65G54/02

Abstract: Disclosed herein are systems and methods relating to a transfer chamber for an electronic device processing system. The transfer chamber can include a first magnetic levitation track having a face-up orientation and a second magnetic levitation track spaced from the first magnetic levitation track and having a face-down orientation. The system can include substrate carriers that move along the first and second magnetic levitation tracks where each substrate carrier includes a magnet on a bottom portion to interact with a first magnetic field and a second magnet on a top portion to interact with a second magnetic field. The system also can include at least one lift pin assembly to move the substrate carriers in a vertical direction between the first and second magnetic levitation tracks.

公开(公告)号：US20210358788A1

公开(公告)日：2021-11-18

申请号：US17370802

申请日：2021-07-08

Applicant: Applied Materials, Inc.

Inventor： Alex Berger ,  Jeffrey Hudgens ,  Eric Englhardt

IPC: H01L21/677 ,  B65G54/02 ,  B25J11/00

Abstract: Disclosed herein are systems and methods relating to a transfer chamber for an electronic device processing system. The transfer chamber can include a first magnetic levitation track having a face-up orientation and a second magnetic levitation track spaced from the first magnetic levitation track and having a face-down orientation. The system can include substrate carriers that move along the first and second magnetic levitation tracks where each substrate carrier includes a magnet on a bottom portion to interact with a first magnetic field and a second magnet on a top portion to interact with a second magnetic field. The system also can include at least one lift pin assembly to move the substrate carriers in a vertical direction between the first and second magnetic levitation tracks.

公开(公告)号：US11784074B2

公开(公告)日：2023-10-10

申请号：US17370802

申请日：2021-07-08

Applicant: Applied Materials, Inc.

Inventor： Alex Berger ,  Jeffrey Hudgens ,  Eric Englhardt

IPC: H01L21/677 ,  B65G54/02 ,  B25J11/00

CPC classification number: H01L21/67709 ,  B25J11/0095 ,  B65G54/02

Abstract: Disclosed herein are systems and methods relating to a transfer chamber for an electronic device processing system. The transfer chamber can include a first magnetic levitation track having a face-up orientation and a second magnetic levitation track spaced from the first magnetic levitation track and having a face-down orientation. The system can include substrate carriers that move along the first and second magnetic levitation tracks where each substrate carrier includes a magnet on a bottom portion to interact with a first magnetic field and a second magnet on a top portion to interact with a second magnetic field. The system also can include at least one lift pin assembly to move the substrate carriers in a vertical direction between the first and second magnetic levitation tracks.

公开(公告)号：US20210296150A1

公开(公告)日：2021-09-23

申请号：US16825450

申请日：2020-03-20

Applicant: APPLIED MATERIALS, INC.

Inventor： Alex Berger ,  Jeffrey Hudgens ,  Eric Englhardt

IPC: H01L21/677 ,  B25J11/00 ,  B65G54/02

Abstract: Disclosed herein are systems and methods relating to a transfer chamber for an electronic device processing system. The transfer chamber can include a first magnetic levitation track having a face-up orientation and a second magnetic levitation track spaced from the first magnetic levitation track and having a face-down orientation. The system can include substrate carriers that move along the first and second magnetic levitation tracks where each substrate carrier includes a magnet on a bottom portion to interact with a first magnetic field and a second magnet on a top portion to interact with a second magnetic field. The system also can include at least one lift pin assembly to move the substrate carriers in a vertical direction between the first and second magnetic levitation tracks.