公开(公告)号：US20030129044A1

公开(公告)日：2003-07-10

申请号：US10041291

申请日：2002-01-07

申请人： APPLIED MATERIALS, INC.

发明人： Charles S. Kunze ,  Andrew V. Le ,  Muhammad Rasheed

IPC分类号： F16K001/00

CPC分类号： F16K51/02 ,  Y10S414/139

摘要： Embodiments of the present invention provide structures for reducing erosion of a slit valve utilized in the fabrication of semiconductor devices. Specifically, non-metallic slit valve components such as a compressible sealing member and a barrier that assist in sealing the valve closure against the slit valve seat, are positioned on the valve seat rather than on the valve closure. This orientation removes the seal and the seal barrier from the direct line of sight of the plasma within the processing chamber, reducing exposure of the sealing member and seal barrier slit valve components to erosion and thereby extending the lifetime of the valve.

摘要翻译： 本发明的实施例提供了用于减少用于制造半导体器件的狭缝阀的侵蚀的结构。 具体而言，诸如可压缩密封构件和有助于将阀门关闭密封在狭缝阀座上的屏障的非金属狭缝阀部件定位在阀座而不是阀闭合件上。 该方向将密封件和密封件阻挡物从处理室内的等离子体的直接视线移除，减少了密封构件的暴露并将阻挡狭缝阀部件密封，从而延长了阀的使用寿命。