公开(公告)号：US20040231706A1

公开(公告)日：2004-11-25

申请号：US10444284

申请日：2003-05-22

申请人： Applied Materials, Inc.

发明人： Ashish Bhatnagar ,  Charles S. Kunze

IPC分类号： B08B007/04 ,  B08B003/00

CPC分类号： C23C16/4407 ,  B08B7/0035 ,  B08B7/04 ,  B08B9/00 ,  Y10S438/905

摘要： Process deposits formed on a component of a process chamber are cleaned. In the cleaning method, gas holes in the component are mechanically pinned to clean the process deposits therein. A ceramic portion of the component is then exposed to an acidic solution, such as a solution of hydrofluoric acid and nitric acid. Mechanical pinning of the gas holes may be repeated after the acid cleaning step. The component is then plasma stabilized in a plasma zone by introducing a non-reactive gas into the plasma zone and forming a plasma of the non-reactive gas in the plasma zone. In one version, the component comprises an electrostatic chuck comprising a ceramic covering an electrode and having the gas holes therein.

摘要翻译： 在处理室的部件上形成的工艺沉积物被清洁。 在清洁方法中，组件中的气孔被机械固定以清洁其中的工艺沉积物。 然后将组分的陶瓷部分暴露于酸性溶液，例如氢氟酸和硝酸溶液中。 在酸洗步骤之后，可以重复气孔的机械固定。 然后通过将非反应性气体引入等离子体区域并在等离子体区域中形成非反应性气体的等离子体，将等离子体部件等离子体稳定化。 在一个版本中，该部件包括静电卡盘，其包括覆盖电极并且在其中具有气孔的陶瓷。

公开(公告)号：US20030129044A1

公开(公告)日：2003-07-10

申请号：US10041291

申请日：2002-01-07

申请人： APPLIED MATERIALS, INC.

发明人： Charles S. Kunze ,  Andrew V. Le ,  Muhammad Rasheed

IPC分类号： F16K001/00

CPC分类号： F16K51/02 ,  Y10S414/139

摘要： Embodiments of the present invention provide structures for reducing erosion of a slit valve utilized in the fabrication of semiconductor devices. Specifically, non-metallic slit valve components such as a compressible sealing member and a barrier that assist in sealing the valve closure against the slit valve seat, are positioned on the valve seat rather than on the valve closure. This orientation removes the seal and the seal barrier from the direct line of sight of the plasma within the processing chamber, reducing exposure of the sealing member and seal barrier slit valve components to erosion and thereby extending the lifetime of the valve.

摘要翻译： 本发明的实施例提供了用于减少用于制造半导体器件的狭缝阀的侵蚀的结构。 具体而言，诸如可压缩密封构件和有助于将阀门关闭密封在狭缝阀座上的屏障的非金属狭缝阀部件定位在阀座而不是阀闭合件上。 该方向将密封件和密封件阻挡物从处理室内的等离子体的直接视线移除，减少了密封构件的暴露并将阻挡狭缝阀部件密封，从而延长了阀的使用寿命。