OBTAINING SUBSTRATE METROLOGY MEASUREMENT VALUES USING MACHINE LEARNING

    公开(公告)号:US20220397515A1

    公开(公告)日:2022-12-15

    申请号:US17344788

    申请日:2021-06-10

    Abstract: A machine learning model trained to provide metrology measurements for a substrate is provided. Training data generated for a prior substrate processed according to a prior process is provided to train the model. The training data includes a training input including a subset of historical spectral data extracted from a normalized set of historical spectral data collected for the prior substrate during the prior process. The subset of historical spectral data includes an indication of historical spectral features associated with a particular type of metrology measurement. The training data also includes a training output including a historical metrology measurement obtained for the prior substrate, the historical metrology measurement associated with the particular type of metrology measurement. Spectral data is collected for a current substrate processed according to a current process. A subset of current data extracted from a normalized set of the spectral data for the current substrate is provided as input to the trained model. Metrology measurement data for the current substrate is extracted from one or more outputs of the trained model.

    Substrate process endpoint detection using machine learning

    公开(公告)号:US11901203B2

    公开(公告)日:2024-02-13

    申请号:US17344787

    申请日:2021-06-10

    CPC classification number: H01L21/67253 G01N21/9501 G06N20/00 G05B13/0265

    Abstract: Methods and systems for detection of an endpoint of a substrate process are provided. A set of machine learning models are trained to provide a metrology measurement value associated with a particular type of metrology measurement for a substrate based on spectral data collected for the substrate. A respective machine learning model is selected to be applied to future spectral data collected during a future substrate process for a future substrate in view of a performance rating associated with the particular type of metrology measurement. Current spectral data is collected during a current process for a current substrate and provided as input to the respective machine learning model. An indication of a respective metrology measurement value corresponding to the current substrate is extracted from one or more outputs of the trained machine learning model. In response to a determination that the respective metrology measurement satisfies a metrology measurement criterion, an instruction including a command to terminate the current process is generated.

    SUBSTRATE PROCESS ENDPOINT DETECTION USING MACHINE LEARNING

    公开(公告)号:US20220399215A1

    公开(公告)日:2022-12-15

    申请号:US17344787

    申请日:2021-06-10

    Abstract: Methods and systems for detection of an endpoint of a substrate process are provided. A set of machine learning models are trained to provide a metrology measurement value associated with a particular type of metrology measurement for a substrate based on spectral data collected for the substrate. A respective machine learning model is selected to be applied to future spectral data collected during a future substrate process for a future substrate in view of a performance rating associated with the particular type of metrology measurement. Current spectral data is collected during a current process for a current substrate and provided as input to the respective machine learning model. An indication of a respective metrology measurement value corresponding to the current substrate is extracted from one or more outputs of the trained machine learning model. In response to a determination that the respective metrology measurement satisfies a metrology measurement criterion, an instruction including a command to terminate the current process is generated.

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