公开(公告)号：US20180323091A1

公开(公告)日：2018-11-08

申请号：US15966211

申请日：2018-04-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Preetham Rao ,  Dennis Ivanov ,  Ananthkrishna Jupudi ,  Yueh Sheng Ow

IPC: H01L21/67 ,  H05B6/64 ,  H05B6/66 ,  H05B6/70

CPC classification number: H01L21/67115 ,  H05B6/6402 ,  H05B6/664 ,  H05B6/705 ,  H05B6/707

Abstract: Methods and apparatus for uniform thermal distribution across semiconductor batches are provided herein. According to one embodiment, a microwave oven for semiconductor processing, comprising a thermal housing having a cavity and a plurality of input ports, a power source configured to provide a microwave signal to the cavity of the thermal housing via the plurality of input ports, a phase shifter disposed between the power source and the input ports, wherein the phase shifter is configured to vary a phase difference between two or more signals provided to it; and a controller communicatively coupled to the phase shifter and configured to control the phase difference between the two or more signals.