公开(公告)号：US10930542B2

公开(公告)日：2021-02-23

申请号：US16272811

申请日：2019-02-11

Applicant: APPLIED MATERIALS, INC.

Inventor： Sriskantharajah Thirunavukarasu ,  Eng Sheng Peh ,  Karrthik Parathithasan ,  Fang Jie Lim

IPC: H01L21/687 ,  H01L21/677 ,  H01L21/683 ,  H01L21/67

Abstract: Embodiments of methods and apparatus for handling substrates of different sizes are provided herein. In some embodiments, an apparatus for handling substrates of different sizes includes: a pair of end effectors having a first set of contact pads configured to support a substrate having a first size and a second set of contact pads configured to support a substrate having a second size, smaller than the first size.

公开(公告)号：US11871667B2

公开(公告)日：2024-01-09

申请号：US17023999

申请日：2020-09-17

Applicant: APPLIED MATERIALS, INC.

Inventor： Sriskantharajah Thirunavukarasu ,  Puay Han Tan ,  Karrthik Parathithasan ,  Jun-Liang Su ,  Fang Jie Lim ,  Chin Wei Tan ,  Wei Jie Dickson Teo

IPC: H10N10/17 ,  H01L23/00 ,  H05K1/02

CPC classification number: H10N10/17 ,  H01L23/562 ,  H05K1/0271

Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a system for processing a substrate includes a process chamber comprising a first processing volume and a second processing volume, a carrier disposed in the first processing volume, comprising a first thermoelectric module (TEM), and configured to support the substrate while the substrate is being heated or cooled, a chuck disposed within the second processing volume, comprising a second TEM, and configured to receive the substrate from the carrier and to support the substrate while the substrate is being heated or cooled, and a system controller configured to monitor a temperature of at least one of the substrate, the carrier, or the chuck during operation, and based on the temperature of the at least one of the substrate, the carrier, or the chuck, supply current to at least one of the first TEM or the second TEM.