公开(公告)号：US20180101103A1

公开(公告)日：2018-04-12

申请号：US15829809

申请日：2017-12-01

Applicant: APPLIED MATERIALS, INC.

Inventor： Mangesh BANGAR ,  Bruce E. ADAMS ,  Kelly E. HOLLAR ,  Abhilash J. MAYUR ,  Huixiong DAI ,  Jaujiun CHEN

IPC: G03F7/20

CPC classification number: G03F7/70633

Abstract: A calibration curve for a wafer comprising a layer on a substrate is determined. The calibration curve represents a local parameter change as a function of a treatment parameter associated with a wafer exposure to a light. The local parameter of the wafer is measured. An overlay error is determined based on the local parameter of the wafer. A treatment map is computed based on the calibration curve to correct the overlay error for the wafer. The treatment map represents the treatment parameter as a function of a location on the wafer.