公开(公告)号：US20210033557A1

公开(公告)日：2021-02-04

申请号：US16526268

申请日：2019-07-30

Applicant: APPLIED MATERIALS, INC.

Inventor： PATRICK TAE ,  YAOLING PAN ,  LEONARD M. TEDESCHI

IPC: G01N27/22 ,  H01J37/32 ,  C23C16/46 ,  C23C16/04 ,  C23C16/52

Abstract: Methods and apparatus for a processing chamber are provided herein. The apparatus includes, for example, an inner volume defined in the processing chamber; a first sensor assembly coupled to a surface located in the inner volume of the processing chamber and including a first electrode configuration configured to measure an electrical characteristic associated with a film deposited within the inner volume of the processing chamber; and a second sensor assembly coupled to the surface located in the inner volume of the processing chamber in relative proximity to the first sensor assembly and including a second electrode configuration, different from the first electrode configuration, configured to measure the same electrical characteristic as the first electrode configuration.