公开(公告)号：US20180142340A1

公开(公告)日：2018-05-24

申请号：US15814696

申请日：2017-11-16

Applicant: APPLIED MATERIALS, INC.

Inventor： WILLIAM JOHANSON ,  SIEW KIT HOI ,  JOHN MAZZOCCO ,  KIRANKUMAR SAVANDAIAH ,  PRASHANT PRABHU

IPC: C23C14/04 ,  C23C14/34

CPC classification number: C23C14/042 ,  C23C14/34 ,  H01J37/32477 ,  H01J37/34

Abstract: Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes an adapter having an adapter body and a shield portion radially inward of the adapter body; a heat transfer channel formed in the adapter body; a shadow ring coupled to the adapter such that the shield portion of the adapter extends over a portion of the shadow ring; and a ceramic insulator disposed between the shadow ring and the adapter to electrically isolate the shadow ring from the adapter.