公开(公告)号：US20190390949A1

公开(公告)日：2019-12-26

申请号：US16432104

申请日：2019-06-05

Applicant: APPLIED MATERIALS, INC.

Inventor： KAI WU ,  WEI MIN CHAN ,  PEIQI WANG ,  PAUL MA ,  EDWARD BUDIARTO ,  KUN XU ,  TODD J. EGAN

IPC: G01B7/06 ,  C23C16/52

Abstract: A method and system for determining a thickness of a conductive film layer deposited on a wafer include at two eddy current sensors to take electrical resistivity measurements of the conductive film layer on the wafer as the wafer is being transported by a robot arm, a temperature sensor to determine a temperature change of the wafer during the electrical resistivity measurement, and a processing device to adjust a value of the electrical resistivity measurement by an amount based on the determined temperature change and to determine a thickness of the conductive film layer using the adjusted value of the electrical resistivity measurement and a previously determined correlation between electrical resistivity measurement values and respective thicknesses of conductive film layers. Alternatively, the wafer can be kept at a steady temperature when taking electrical resistivity measurements of the conductive film layer to determine a thickness of the conductive film layer.