公开(公告)号：US20030201066A1

公开(公告)日：2003-10-30

申请号：US10134891

申请日：2002-04-29

Applicant: APPLIED OPTOELECTRONICS, INC.

Inventor： Brian Ishaug ,  Chung-Yung Wang ,  Hung-Lun Chang

IPC: B32B001/00

CPC classification number: H01L21/67132 ,  B26D1/035 ,  B26D1/095 ,  Y10S156/941 ,  Y10S438/976 ,  Y10T156/1057 ,  Y10T156/1082 ,  Y10T156/1179 ,  Y10T156/19 ,  Y10T156/1967

Abstract: Demounting workpieces attached to an adhesive surface of an adhesive film with a workpiece demounting apparatus having a base and a plurality of substantially parallel blades mounted to the base. Each of the blades has a substantially linear blade edge, each blade edge lying within a blade-edge plane that is substantially perpendicular to the blades. The spacing between the blades is small enough to support said workpieces and large enough to permit the adhesive film to pass between the blades after being cut by said blade edges during a workpiece demounting operation. The plurality of blade edges thus provides a substantially planar blade-edge surface, in the blade-edge plane, for cutting the adhesive film and for supporting the workpieces while the adhesive film is pulled free from said workpieces.

Abstract translation: 用工件拆卸装置将附着到粘合剂膜的粘合剂表面上的工件拆卸，所述工件拆卸装置具有安装到基座的基部和多个基本上平行的叶片。 每个叶片具有基本上线性的叶片边缘，每个叶片边缘位于基本上垂直于叶片的叶片边缘平面内。 叶片之间的间隔足够小以支撑所述工件并且足够大以允许粘合膜在工件拆卸操作期间被所述叶片边缘切割之后在刀片之间通过。 因此，多个叶片边缘在叶片边缘平面中提供基本平坦的叶片边缘表面，用于切割粘合剂膜并且在粘合膜被拉离所述工件时支撑工件。