公开(公告)号：US11864365B2

公开(公告)日：2024-01-02

申请号：US17951297

申请日：2022-09-23

Applicant: APTIV TECHNOLOGIES LIMITED

Inventor： Janusz Duralek ,  Krzysztof Adamczyk

IPC: H05K9/00

CPC classification number: H05K9/0015

Abstract: An electromagnetic compatibility (EMC) housing having a first part and a second part for forming an enclosure when fitted together. The first and second parts include first and second interface surfaces respectively, for compressing a gasket interposed between the interface surfaces when the first and second parts are fitted together. At least one of the first and second interface surfaces includes a plurality of undercut regions for reducing compression of the gasket in the region when the first and second parts are fitted together.

公开(公告)号：US20190335621A1

公开(公告)日：2019-10-31

申请号：US16466471

申请日：2017-12-07

Applicant: Aptiv Technologies Limited

Inventor： Grzegorz Szostek ,  Marcin Hyrlicki ,  Krzysztof Adamczyk ,  Pawel Brache

IPC: H05K7/20 ,  F28F13/00

Abstract: A heat dissipation device comprises a generally rectangular metal cooling plate; the metal plate comprises, on its upper face, first attachment means for attaching a first printed circuit board, which means are provided for bringing at least one heat-generating zone of the first printed circuit board to bear with the upper face of the plate; the metal plate comprises, on its lower face, second attachment means for attaching a second printed circuit board, which means are provided for bringing at least one heat-generating zone of the second printed circuit board to bear with the lower face of the plate.