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公开(公告)号:US11523530B2
公开(公告)日:2022-12-06
申请号:US17128328
申请日:2020-12-21
Applicant: APTIV TECHNOLOGIES LIMITED
Inventor: David R. Peterson , Jared Bilas , Kurt P. Seifert , Jeffrey S. Campbell , Wesley W. Weber, Jr. , Christian Schaefer
IPC: H01R13/62 , H05K7/12 , B60R16/02 , B60R16/023 , H01R12/77 , H01R13/518 , H01R13/631 , H02G1/06 , H02G3/32 , H01R12/70 , H05K7/04
Abstract: A self-aligning mechanical mount and electrical connection system for an electronic module comprises a mechanical mount assembly configured to be integrated into or attached to a base frame and defining a mount connection position assurance (CPA) feature for self-aligning and securing of the electronic module therein, and an electrical connection assembly configured to be integrated into or attached to the mechanical mount assembly and comprising a modular electrical connector (i) being electrically connected to an electrical backbone wire cable and (ii) defining a connector CPA feature for self-aligning the modular electrical connector with a corresponding electrical connector integrated into or attached to the electronic module when the electronic module is secured in the mechanical mount assembly.
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公开(公告)号:US12075586B2
公开(公告)日:2024-08-27
申请号:US18073791
申请日:2022-12-02
Applicant: APTIV TECHNOLOGIES LIMITED
Inventor: David R. Peterson , Jared Bilas , Kurt P. Seifert , Jeffrey S. Campbell , Wesley W. Weber, Jr. , Christian Schaefer
IPC: H01R13/62 , B60R16/02 , B60R16/023 , H01R12/77 , H01R13/518 , H01R13/631 , H02G1/06 , H02G3/32 , H05K7/12 , H01R12/70 , H05K7/04
CPC classification number: H05K7/12 , B60R16/0207 , B60R16/0239 , H01R12/771 , H01R13/518 , H01R13/631 , H02G1/06 , H02G3/32 , H01R12/7082 , H01R2201/26 , H05K7/04
Abstract: A self-aligning mechanical mount and electrical connection system for an electronic module comprises a mechanical mount assembly configured to be integrated into or attached to a base frame and defining a mount connection position assurance (CPA) feature for self-aligning and securing of the electronic module therein, and an electrical connection assembly configured to be integrated into or attached to the mechanical mount assembly and comprising a modular electrical connector (i) being electrically connected to an electrical backbone wire cable and (ii) defining a connector CPA feature for self-aligning the modular electrical connector with a corresponding electrical connector integrated into or attached to the electronic module when the electronic module is secured in the mechanical mount assembly.
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公开(公告)号:US11309660B1
公开(公告)日:2022-04-19
申请号:US17075988
申请日:2020-10-21
Applicant: Aptiv Technologies Limited
Inventor: Jeffrey S. Campbell , Wesley W. Weber, Jr.
IPC: H01R13/533 , H01R13/627 , H01R13/506
Abstract: A connector assembly includes a connector body, a corresponding mating connector body, and a connection position assurance (CPA) device. The connector body includes a deflectable latching member and at least one outer detent feature located on an outer surface of the connector body. The corresponding mating connector body is configured to be removably connected with the connector body, wherein the deflectable latching member is configured to secure the connector body to the corresponding mating connector body. The CPA device is slidably positioned adjacent the connector body and moveable from a pre-stage position to a full-stage position, wherein the CPA device interacts with the at least one outer detent feature located on the outer surface of the connector body to deflect the connector body towards the corresponding mating connector body.
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公开(公告)号:US10923844B2
公开(公告)日:2021-02-16
申请号:US16829184
申请日:2020-03-25
Applicant: Aptiv Technologies Limited
Inventor: Jeffrey S. Campbell , Wesley W. Weber, Jr.
Abstract: A printed circuit board assembly includes a circuit board substrate and a circuit board trace having a circuit board contact region configured to be in intimate contact with a cable contact region of a cable circuit trace contained in flat cable. The circuit board contact region defines a plurality of ridges protruding from a circuit board substrate surface.
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