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公开(公告)号:US11075026B2
公开(公告)日:2021-07-27
申请号:US16399924
申请日:2019-04-30
Inventor: Minglu Liu , Karl Sieradzki , Brandon Dowd , Rodolfo E. Diaz
Abstract: Embodiments herein describe techniques for a magnetic conductive device including a substrate, an under layer above the substrate, and a magnetic conductive layer including NiFe alloy formed on the under layer. A method for forming a magnetic conductive device includes forming a support stack including an under layer above a substrate, cleaning the support stack, and performing electrodeposition on the under layer by placing the support stack into a plating bath to form NiFe alloy on the under layer. The NiFe alloy includes Ni in a range of about 74% to about 84%, and Fe in a range of about 26% to about 16%. Other embodiments may be described and/or claimed.