-
公开(公告)号:US10269783B2
公开(公告)日:2019-04-23
申请号:US15004852
申请日:2016-01-22
Applicant: ARM Limited
IPC: H01L21/74 , H01L27/02 , H01L29/06 , H01L21/265 , H01L23/522 , H01L23/528 , H01L27/118 , H01L21/8234 , H01L21/8238 , H01L23/48 , H01L23/52 , H01L29/40
Abstract: Various implementations described herein are directed to an integrated circuit. The integrated circuit may include a cell having a first region designated for a first type of implant and a second region designated for a second type of implant that is different than the first type of implant. The integrated circuit may include a first implant structure configured to implant the first region with the first type of implant such that the first region extends within a portion of the second region. The integrated circuit may include a second implant structure configured to implant the second region with the second type of implant such that the second region extends within a portion of the first region.
-
公开(公告)号:US20170213814A1
公开(公告)日:2017-07-27
申请号:US15004852
申请日:2016-01-22
Applicant: ARM Limited
IPC: H01L27/02 , H01L23/522 , H01L21/265 , H01L23/528 , H01L29/06 , H01L21/8234
CPC classification number: H01L27/0207 , H01L21/26513 , H01L21/743 , H01L21/823493 , H01L21/823892 , H01L23/5226 , H01L23/528 , H01L27/11807 , H01L29/0688 , H01L2027/11861
Abstract: Various implementations described herein are directed to an integrated circuit. The integrated circuit may include a cell having a first region designated for a first type of implant and a second region designated for a second type of implant that is different than the first type of implant. The integrated circuit may include a first implant structure configured to implant the first region with the first type of implant such that the first region extends within a portion of the second region. The integrated circuit may include a second implant structure configured to implant the second region with the second type of implant such that the second region extends within a portion of the first region.
-