公开(公告)号：US3522517A

公开(公告)日：1970-08-04

申请号：US3522517D

申请日：1968-04-17

Applicant: ASEA AB

Inventor： BACKMAN OWE ,  WIDAKOWICH MARIUS

IPC: H02M7/48 ,  H02M1/08

CPC classification number: H02M7/48

公开(公告)号：US3610997A

公开(公告)日：1971-10-05

申请号：US3610997D

申请日：1970-04-07

Applicant: ASEA AB

Inventor： LUNDQUIST DICK ,  WIDAKOWICH MARIUS

IPC: H01L35/32 ,  H01M27/00

CPC classification number: H01L35/32 ,  Y10T428/12528

Abstract: A semiconductor element for a thermoelectric heat pump, with a body of semiconducting material which is shaped as a shell with essentially constant wall thickness, a first cup-shaped metal electrode in contact with the outer surface of the body, a second metal electrode in contact with the inner surface of the body, both electrodes having smaller cross sections at the open end of the cavity defined by said first electrode, whereby forces tending to pull the electrodes apart are prevented from exerting any tensile or shear stresses on the semiconductor material.