公开(公告)号：US20230123675A1

公开(公告)日：2023-04-20

申请号：US18046102

申请日：2022-10-12

Applicant: ASICS CORPORATION

Inventor： Keita OZAWA ,  Hisanori FUJITA ,  Yousuke ATARASHI ,  Kota MIYOSHI

IPC: A43B13/18 ,  A43B7/148 ,  A43B7/144

Abstract: A sole includes a midsole body and a buffer member made of a material having hardness lower than that of a material constituting the midsole body. A mounting portion that mounts the buffer member is formed on a surface of a rearfoot region of the midsole body. The buffer member is mounted on the mounting portion in a non-adhesive state. One of the mounting portion and the buffer member includes a reference surface and a protrusion. The other of the mounting portion and the buffer member includes a recess. The recess includes a surrounding wall having a shape that entirely surrounds a periphery of the protrusion.