公开(公告)号：US20240153746A1

公开(公告)日：2024-05-09

申请号：US18413728

申请日：2024-01-16

Applicant: ASM IP Holding B.V.

Inventor： WonKi Jeong ,  Yonjong Jeon ,  DongJun Park

IPC: H01J37/32

CPC classification number: H01J37/32513 ,  H01J37/3244

Abstract: A substrate processing apparatus having a simplified exhaust structure includes: a substrate supporting unit configured to support a substrate; a first lid on the substrate supporting unit, the first lid including at least one processing unit; a second lid under the first lid, the second lid including a partition wall; and a support arranged under the first lid and the second lid and including an opening and a seating portion on the opening, wherein the second lid is on the seating portion of the support.

公开(公告)号：US20230187260A1

公开(公告)日：2023-06-15

申请号：US18078229

申请日：2022-12-09

Applicant: ASM IP Holding B.V.

Inventor： Wonki Jeong ,  DaeYoun Kim ,  DongJun Park

IPC: H01L21/687

CPC classification number: H01L21/68742 ,  H01L21/68785 ,  H01L21/68757

Abstract: In one embodiment according to the disclosure, an apparatus for manipulating substrates in semiconductor processing comprising a plurality of lift pins, comprising a top end and a down end, and configured for the top end can move upward to an UP position and move downward to a DOWN position, wherein the top end supports a wafer, a weight comprising a plurality of lift pin holes and is configured to connect the plurality of lift pins and a plurality of weight supports, each of them are configured to attach to the plurality of lift pins respectively and each of them are to be placed in the plurality of lift pin holes respectively is presented. The embodiment can improve the semiconductor processing efficiency by preventing the lift pins from getting stuck.