公开(公告)号：US20250079234A1

公开(公告)日：2025-03-06

申请号：US18817390

申请日：2024-08-28

Applicant: ASM IP Holding B.V.

Inventor： Hang Zhang

IPC: H01L21/687 ,  H01L21/324

Abstract: A method, system and apparatus for substrate processing that includes a susceptor, a thermal protection plate disposed above the susceptor, the thermal protection plate includes a first lift pin through-hole extending from a top surface of the thermal protection plate to a bottom surface of the thermal protection plate, the susceptor includes a second lift pin through-hole and a plate lift member through-hole, and a plate lift member configured to slidably engage the plate lift member through-hole.

公开(公告)号：US20250079223A1

公开(公告)日：2025-03-06

申请号：US18817440

申请日：2024-08-28

Applicant: ASM IP Holding B.V.

Inventor： Shubham Garg ,  Hang Zhang ,  Todd Robert Dunn ,  George B. Jackson

IPC: H01L21/683

Abstract: Various embodiments of the present technology may provide a susceptor assembly. The susceptor assembly may include a susceptor plate and a cap disposed on a surface of the susceptor plate. The cap may have electrodes embedded within it. The susceptor plate may have heating elements embedded within it. The cap may be separated from the susceptor plate by an air gap formed by a plurality of dielectric spacers. The plurality of dielectric spacers may be sized for minimal contact on the cap.