公开(公告)号：US10566223B2

公开(公告)日：2020-02-18

申请号：US15598169

申请日：2017-05-17

Applicant: ASM IP Holding B.V.

Inventor： Keith R. Lawson ,  Michael E. Givens

IPC: G06F19/00 ,  H01L21/67 ,  G05B19/418

Abstract: Embodiments of the present disclosure can help increase throughput and reduce resource conflicts and delays in semiconductor processing tools. An exemplary method according to various aspects of the present disclosure includes analyzing, by a computer program operating on a computer system, a plurality of expected times to complete each of a respective plurality of actions to be performed by a semiconductor processing tool, the semiconductor processing too including a first process module and a second process module.

公开(公告)号：US20170256429A1

公开(公告)日：2017-09-07

申请号：US15598169

申请日：2017-05-17

Applicant: ASM IP Holding B.V.

Inventor： Keith R. Lawson ,  Michael E. Givens

IPC: H01L21/67 ,  G05B19/418

Abstract: Embodiments of the present disclosure can help increase throughput and reduce resource conflicts and delays in semiconductor processing tools. An exemplary method according to various aspects of the present disclosure includes analyzing, by a computer program operating on a computer system, a plurality of expected times to complete each of a respective plurality of actions to be performed by a semiconductor processing tool, the semiconductor processing tool including a first process module and a second process module. The method further includes generating, by the computer program, a wafer processing plan based on the analysis, wherein the wafer processing plan, when executed by the processing tool, causes the semiconductor processing tool to: load a first wafer into the first process module; unload a second wafer from the second process module after loading the first wafer into the first process module; load the third wafer into the first process module after unloading the second wafer from the second process module; and unload the first wafer from the first process module after loading the third wafer into the first process module.