公开(公告)号：US11473195B2

公开(公告)日：2022-10-18

申请号：US15909705

申请日：2018-03-01

Applicant: ASM IP Holding B.V.

Inventor： Petri Raisanen ,  David Marquardt ,  Thomas Aswad

IPC: C23C16/44 ,  C23C16/56 ,  C23C16/455 ,  C23C16/458 ,  C23C16/46

Abstract: A semiconductor processing apparatus is disclosed. The apparatus may include, a reaction chamber and a susceptor dispose in the reaction chamber configured for supporting a substrate thereon, the susceptor comprising a plurality of through-holes in an axial direction of the susceptor. The apparatus may also include, a plurality of lift pins, each of the lift pins being disposed within a respective through-hole, and at least one gas transmitting channel comprising one or more gas channel outlets, the one or more gas channel outlets being disposed proximate to the through-holes. Methods for processing a substrate within a reaction chamber are also disclosed.

公开(公告)号：US20230017569A1

公开(公告)日：2023-01-19

申请号：US17947230

申请日：2022-09-19

Applicant: ASM IP Holding B.V.

Inventor： Petri Raisanen ,  David Marquardt ,  Thomas Aswad

IPC: C23C16/44 ,  C23C16/56 ,  C23C16/46 ,  C23C16/455 ,  C23C16/458

Abstract: A semiconductor processing apparatus is disclosed. The apparatus may include, a reaction chamber and a susceptor dispose in the reaction chamber configured for supporting a substrate thereon, the susceptor comprising a plurality of through-holes in an axial direction of the susceptor. The apparatus may also include, a plurality of lift pins, each of the lift pins being disposed within a respective through-hole, and at least one gas transmitting channel comprising one or more gas channel outlets, the one or more gas channel outlets being disposed proximate to the through-holes. Methods for processing a substrate within a reaction chamber are also disclosed.

公开(公告)号：US12018365B2

公开(公告)日：2024-06-25

申请号：US17947230

申请日：2022-09-19

Applicant: ASM IP Holding B.V.

Inventor： Petri Raisanen ,  David Marquardt ,  Thomas Aswad

IPC: C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  C23C16/46 ,  C23C16/56

CPC classification number: C23C16/4407 ,  C23C16/4404 ,  C23C16/4405 ,  C23C16/45565 ,  C23C16/4581 ,  C23C16/46 ,  C23C16/56

Abstract: A semiconductor processing apparatus is disclosed. The apparatus may include, a reaction chamber and a susceptor dispose in the reaction chamber configured for supporting a substrate thereon, the susceptor comprising a plurality of through-holes in an axial direction of the susceptor. The apparatus may also include, a plurality of lift pins, each of the lift pins being disposed within a respective through-hole, and at least one gas transmitting channel comprising one or more gas channel outlets, the one or more gas channel outlets being disposed proximate to the through-holes. Methods for processing a substrate within a reaction chamber are also disclosed.

公开(公告)号：US20190271078A1

公开(公告)日：2019-09-05

申请号：US15909705

申请日：2018-03-01

Applicant: ASM IP Holding B.V.

Inventor： Petri Raisanen ,  David Marquardt ,  Thomas Aswad

IPC: C23C16/44 ,  C23C16/56 ,  C23C16/455 ,  C23C16/458 ,  C23C16/46

Abstract: A semiconductor processing apparatus is disclosed. The apparatus may include, a reaction chamber and a susceptor dispose in the reaction chamber configured for supporting a substrate thereon, the susceptor comprising a plurality of through-holes in an axial direction of the susceptor. The apparatus may also include, a plurality of lift pins, each of the lift pins being disposed within a respective through-hole, and at least one gas transmitting channel comprising one or more gas channel outlets, the one or more gas channel outlets being disposed proximate to the through-holes. Methods for processing a substrate within a reaction chamber are also disclosed.