公开(公告)号：US10534271B2

公开(公告)日：2020-01-14

申请号：US16477955

申请日：2017-12-04

Applicant: ASML NETHERLANDS B.V.

Inventor： Pieter Jeroen Johan Emanuel Hoefnagels ,  Ronald Frank Kox ,  John Maria Bombeeck ,  Johannes Cornelis Paulus Melman ,  Ruud Hendrikus Martinus Johannes Bloks ,  Patricius Jacobus Neefs

IPC: G03B27/52 ,  G03F7/20

Abstract: A device manufacturing method includes: confining a liquid to an immersion space between a projection system and an object; starting application of an underpressure to an extraction unit to remove fluid from a position proximate an edge of the object before the immersion space moves onto the object; moving the support table along a route comprising a series of motions such that a plurality of target positions on the object pass under the projection system; projecting through the immersion space a beam onto the target portions as the target portions pass under the projection system, the projecting performed to account for a certain predetermined thermal profile in the object; and stopping application of the underpressure at a predetermined time after the immersion space moves off the object for the last time during the series of motions to at least partly induce the certain predetermined thermal profile in the object.

公开(公告)号：US11372339B1

公开(公告)日：2022-06-28

申请号：US17603367

申请日：2020-02-27

Applicant: ASML NETHERLANDS B.V.

Inventor： Giovanni Luca Gattobigio ,  Pieter Jeroen Johan Emanuel Hoefnagels ,  Ronald Frank Kox ,  Marcus Johannes Van Der Zanden ,  Maarten Marinus Van Oene ,  Jorge Alberto Vieyra Salas

IPC: G03F7/20

Abstract: A device manufacturing method using a lithographic apparatus having a localized immersion system for confining an immersion liquid to a space between a projection system and a substrate to be exposed by the projection system, the method including: predicting a set of first locations on the substrate having a risk of residual liquid from the immersion system when exposed using an initial route for a substrate to expose a plurality of fields thereon; determining a set of modifications to the initial route to reduce the risk of residual loss; test exposing at least one test substrate using the initial route; obtaining a set of second locations of defects in the exposed test substrate; selecting a subset of the set of modifications by comparing the first locations and the second locations; and exposing a plurality of production substrates using the initial route modified by the selected subset of modifications.