Method of Measuring a Target, Substrate, Metrology Apparatus, and Lithographic Apparatus

    公开(公告)号:US20180024054A1

    公开(公告)日:2018-01-25

    申请号:US15654813

    申请日:2017-07-20

    Abstract: Disclosed is a method of measuring a target, an associated substrate, a metrology apparatus and a lithographic apparatus. In one arrangement the target comprises a layered structure. The layered structure has a first target structure in a first layer and a second target structure in a second layer. The method comprises illuminating the target with measurement radiation. Scattered radiation formed by interference between plural predetermined diffraction orders is detected. The predetermined diffraction orders are generated by diffraction of the measurement radiation from the first target structure and are subsequently diffracted from the second target structure. A characteristic of the lithographic process is calculated using the detected scattered radiation formed by the interference between the predetermined diffraction orders.

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