公开(公告)号：US11048180B2

公开(公告)日：2021-06-29

申请号：US16571956

申请日：2019-09-16

Applicant: ASML Netherlands B.V.

Inventor： Andrey Nikipelov ,  Vadim Yevgenyevich Banine ,  Christian Gerardus Norbertus Hendricus Marie Cloin ,  Edwin Te Sligte ,  Marcus Adrianus Van De Kerkhof ,  Ferdinandus Martinus Jozef Henricus Van De Wetering

IPC: G03F7/20

Abstract: A component for use in a patterning device environment including a patterning device, wherein the component is treated to suppress EUV plasma-induced contaminant release and/or atomic hydrogen or other radicals induced defectivity. A conduit array comprising at least one conduit, wherein the at least one conduit has been treated to promote adhesion of a contaminant to the at least one conduit.